The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2024
Filed:
Jul. 09, 2021
Applicant:
Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);
Inventor:
Feng Zhou, Ann Arbor, MI (US);
Assignee:
TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., Plano, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/12 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01); B33Y 10/00 (2015.01); B33Y 50/00 (2015.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
H05K 3/1275 (2013.01); H05K 1/0272 (2013.01); H05K 7/205 (2013.01); H05K 7/20509 (2013.01); B33Y 10/00 (2014.12); B33Y 50/00 (2014.12); B33Y 80/00 (2014.12);
Abstract
A method of forming integrated power electronics packages by 3D-printing the PCB on and around power devices includes bonding a power device to a first surface of a cold plate and printing, using a 3D-printer, a circuit board on and around the power devices such that the circuit board includes one or more insulating portions and one or more conductive portions.