The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Aug. 02, 2021
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Koki Sai, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/05 (2006.01); H03H 3/02 (2006.01); H03H 9/02 (2006.01); H03H 9/10 (2006.01); H03H 9/19 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H03H 9/0561 (2013.01); H03H 3/02 (2013.01); H03H 9/02102 (2013.01); H03H 9/02133 (2013.01); H03H 9/1021 (2013.01); H03H 9/19 (2013.01); H05K 3/0014 (2013.01); H05K 3/1291 (2013.01); H03H 2003/022 (2013.01); Y10T 29/49158 (2015.01);
Abstract

A method for manufacturing a ceramic substrate that includes forming a mother multilayer body by positioning a hole in at least one ceramic green sheet among a plurality of laminated ceramic green sheets in a location that does not overlap with a recess formation-planned region in which a recess is to be formed after firing of the mother multilayer body and that overlaps with a singulation-planned line for singulating the mother multilayer body into pieces after firing; and forming the recess in the mother multilayer body before firing by performing press working on the recess formation-planned region of the mother multilayer body.


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