The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Jan. 27, 2021
Applicant:

Materion Corporation, Mayfield Heights, OH (US);

Inventors:

Joseph G. Kaiser, Mayfield Heights, OH (US);

Alejandro J. Lluberes, Mayfield Heights, OH (US);

Assignee:

Materion Corporation, Mayfield Heights, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/03 (2006.01); B32B 7/025 (2019.01); B32B 15/01 (2006.01); C22C 5/08 (2006.01); H01B 1/02 (2006.01); H01H 1/023 (2006.01); H01H 11/04 (2006.01); H01R 43/16 (2006.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); B32B 7/025 (2019.01); B32B 15/018 (2013.01); C22C 5/08 (2013.01); H01B 1/02 (2013.01); H01H 11/041 (2013.01); H01R 43/16 (2013.01); B32B 2457/00 (2013.01); H01H 1/023 (2013.01); Y10T 428/12896 (2015.01); Y10T 428/12903 (2015.01);
Abstract

A layered structure for forming charging terminals for high power applications. In some embodiments, the layered structure may include a substrate and a contact layer disposed over at least a portion of the substrate. The substrate may have a conductivity greater than 40% International Annealed Copper Standard (IACS). The contact layer may demonstrate a coefficient of friction of less than 1.4, such as from 0.1 to 1.4, as measured in accordance with American Society of Testing and Materials (ASTM) G99-17. The contact layer may include a precious-metal-based alloy, such as a silver-samarium alloy.


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