The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2024
Filed:
Sep. 13, 2020
Applicant:
Seoul Semiconductor Co., Ltd., Ansan-si, KR;
Inventors:
Motonobu Takeya, Ansan-si, KR;
Jong Ik Lee, Ansan-si, KR;
Assignee:
Seoul Semiconductor Co., Ltd., Ansan-si, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); G06F 30/30 (2020.01); G06F 30/39 (2020.01); G11C 8/16 (2006.01); G11C 11/412 (2006.01); G11C 11/417 (2006.01); G11C 11/419 (2006.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01); H01L 33/38 (2010.01); H01L 33/52 (2010.01); H01L 33/54 (2010.01); H10B 10/00 (2023.01); H01L 33/06 (2010.01); H01L 33/32 (2010.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); G06F 30/30 (2020.01); G06F 30/39 (2020.01); G11C 8/16 (2013.01); G11C 11/412 (2013.01); G11C 11/417 (2013.01); G11C 11/419 (2013.01); H01L 25/0753 (2013.01); H01L 33/0093 (2020.05); H01L 33/382 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H10B 10/00 (2023.02); H01L 33/06 (2013.01); H01L 33/32 (2013.01); H01L 33/44 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A display apparatus and a method of manufacturing the same are disclosed. The display apparatus includes at least one light emitting diode chip, a conductive portion disposed under the light emitting diode chip and coupled to the light emitting diode chip, and an insulating material surrounding the conductive portion. The conductive portion includes a first conductive portion and a second conductive portion, and the insulating material is formed to expose at least a portion of the upper surfaces of the first conductive portion and the second conductive portion.