The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Oct. 01, 2021
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Kazuya Konishi, Tokyo, JP;

Shinya Soneda, Tokyo, JP;

Tetsuya Nitta, Tokyo, JP;

Akihiko Furukawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/739 (2006.01); H01L 29/861 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7397 (2013.01); H01L 29/861 (2013.01);
Abstract

A semiconductor device includes a first contact layer connected to a lower portion of a first trench contact portion and a second contact layer connected to a lower portion of a second trench contact portion. The distance between a first side portion of a first trench and the first trench contact portion is larger than that between a second side portion of the first trench and the second trench contact portion in a plan view, and the first contact layer is separated from the first side portion and the second contact layer is connected to the second side portion in a cross section. With this structure, it is possible to provide a technique for achieving an appropriate channel region.


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