The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Jun. 02, 2022
Applicants:

Denso Corporation, Kariya, JP;

Toyota Jidosha Kabushiki Kaisha, Toyota, JP;

Mirise Technologies Corporation, Nisshin, JP;

Inventor:

Hiroki Tsuma, Nisshin, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/49 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4933 (2013.01); H01L 29/4236 (2013.01);
Abstract

An aluminum alloy film includes an Al—Si—Mg alloy film containing at least 0.9% by weight to 1.1% by weight of Si and 0.1% by weight to 2.3% by weight of Mg, and the Al—Si—Mg alloy film contains Mg silicide crystals in Al crystals. A semiconductor device includes multiple gate trench structures, an interlayer insulating film covering the trench gate structures, an electrode film covering the interlayer insulating film, an insulating layer and a conductive layer covering the electrode film. The electrode film includes the Al—Si—Mg alloy film.


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