The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2024
Filed:
Dec. 04, 2019
Applicant:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Inventor:
Naoto Sasaki, Kumamoto, JP;
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 27/146 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 24/02 (2013.01); H01L 24/05 (2013.01); H01L 27/14636 (2013.01); H01L 21/76898 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 27/14634 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/0235 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/16227 (2013.01);
Abstract
A semiconductor device according to the present disclosure includes a board and a via. In the board, a wiring layer is embedded. The via extends in a depth direction from a main surface of the board to pierce through the wiring layer, and is connected to the wiring layer on a side peripheral surface.