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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12154837 B1

PDFFull Text
Date of Patent:
Nov. 26, 2024

Filed:

Jan. 12, 2022

Seamless interconnect thresholds using dielectric fluid channels

Applicant:

Sciperio, Inc, Orlando, FL (US);

Inventors:

Jason Benoit, Orlando, FL (US);

Nicholas Willey, Orlando, FL (US);

Paul I. Deffenbaugh, Orlando, FL (US);

Casey W. Perkowski, Winter Park, FL (US);

Samuel LeBlanc, Orlando, FL (US);

Evan McDowell, Orlando, FL (US);

Kenneth H. Church, Orlando, FL (US);

Assignee:

SCIPERIO, INC, Orlando, FL (US);

Attorney:

Goodhue, Coleman & Owens, P.C.

Primary Examiner:

Jasmine J Clark

Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H01L 21/4803 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 24/24 (2013.01); H01L 24/29 (2013.01); H01L 24/82 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/29194 (2013.01); H01L 2224/32221 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/82939 (2013.01); H01L 2224/831 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/838 (2013.01); H01L 2224/92244 (2013.01); H01L 2924/15157 (2013.01);
Abstract

A method may include forming a cavity within a plastic structure with a channel positioned at a perimeter of the cavity, inserting the electronic component into the cavity, dispensing a dielectric fluid into the channel at the perimeter of the cavity, curing the dielectric fluid in situ to secure the electronic component within the cavity with a cured dielectric and printing interconnects for the electronic component.

Find Patent Forward Citations

Benoit, Jason. (2024). Seamless interconnect thresholds using dielectric fluid channels (U.S. Patent No. 12154837). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12154837

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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