The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Apr. 12, 2022
Applicant:

Zeus Co., Ltd., Hwaseong-si, KR;

Inventors:

Seung Dae Baek, Hwaseong-si, KR;

Kuem Dong Heo, Ansan-si, KR;

Sung Yup Kim, Suwon-si, KR;

Jae Hwan Son, Hwaseong-si, KR;

Nam Jin Kim, Suwon-si, KR;

Jun Goo Park, Hwaseong-si, KR;

Assignee:

ZEUS CO., LTD., Hwaseong-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B08B 3/02 (2006.01); B08B 3/12 (2006.01); B08B 13/00 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); B08B 3/022 (2013.01); B08B 3/12 (2013.01); B08B 13/00 (2013.01); H01L 21/02076 (2013.01); H01L 21/67051 (2013.01); H01L 21/67132 (2013.01); H01L 21/68728 (2013.01);
Abstract

A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, a ring cover unit facing a retainer ring portion of the wafer, an expander module installed to move the ring cover unit and configured to press the retainer ring portion toward the vacuum chuck unit such that a gap between dies of the wafer widens, and a chucking module installed in the vacuum chuck unit to restrain the ring cover unit pressed by the expander module to the vacuum chuck unit.


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