The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2024
Filed:
Feb. 12, 2021
Tata Consultancy Services Limited, Mumbai, IN;
Yagnik Pravinchandra Kalariya, Pune, IN;
Amit Gangadhar Salvi, Pune, IN;
Purushottham Gautham Basavarsu, Pune, IN;
TATA CONSULTANCY SERVICES LIMITED, Mumbai, IN;
Abstract
Conventional approaches of physical experiments for the effects of cure kinetics in composites materials may lack in capturing lower length scale effects at bulk level. The computational state of the art approaches has not focused on the issue of scale bridging between multiple length scales for manufacturing effects in composites. This limits its usability for specific materials or situations. Embodiments of the present disclosure provide systems and methods that implement a multiscale analysis for determining residual stress and deformation profiles in molded parts comprising composite material. More specifically, present disclosure implements the multiscale analysis wherein a thermal chemical analysis and thermal mechanical analysis are linked to achieve two-way coupling for curing effects at each node/point of molded parts having composite material to provide flexibility and versatility in terms of exploring multiple material combinations without major modification in the approach.