The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Jul. 27, 2021
Applicant:

Harbin Institute of Technology, Harbin, CN;

Inventors:

Xingji Li, Harbin, CN;

Jianqun Yang, Harbin, CN;

Gang Lv, Harbin, CN;

Yadong Wei, Harbin, CN;

Xiaodong Xu, Harbin, CN;

Tao Ying, Harbin, CN;

Xiuhai Cui, Harbin, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/265 (2006.01); G01R 31/26 (2020.01);
U.S. Cl.
CPC ...
G01R 31/2653 (2013.01); G01R 31/2608 (2013.01); G01R 31/2648 (2013.01);
Abstract

The present invention provides a detection method for sensitive parts of ionization damage in a bipolar transistor, which includes the following steps: selecting an irradiation source, and carrying out irradiation test on the bipolar transistor to be tested; installing the irradiated bipolar transistor on a test bench of a deep level transient spectroscopy system, and setting test parameters; selecting at least two different bias voltages, and testing the bipolar transistor to obtain a deep level transient spectrum; determining whether a defect is an ionization defect according to a peak position of the defect signal in the deep level transient spectrum; determining the defect type as oxidation trapped charges or an interface state according to the level of the defect signal in the deep level transient spectrum; and determining the sensitive area of ionization damage in the bipolar transistor according to the determination result of the defect signal type.


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