The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2024
Filed:
Dec. 11, 2019
Université Paris-saclay, Orsay, FR;
Centre National DE LA Recherche Scientifique, Paris, FR;
Université DE Lille, Lille, FR;
Association Yncréa Hauts-de-france, Lille, FR;
Ecole Centrale DE Lille, Villeneuve-d'Ascq, FR;
Université Polytechnique Hauts-de-france, Valanciennes, FR;
Etienne Herth, Villeneuve Saint Georges, FR;
Christophe Loyez, Festubert, FR;
Laurie Calvet, Versailles, FR;
UNIVERSITÉ PARIS-SACLAY, Gif sur Yvette, FR;
CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, Paris, FR;
UNIVERSITÉ DE LILLE, Lille, FR;
ASSOCIATION YNCREA HAUTS-DE-FRANCE, Lille, FR;
ECOLE CENTRALE DE LILLE, Villeneuve-d'Ascq, FR;
UNIVERSITÉ POLYTECHNIQUE HAUTS-DE-FRANCE, Valanciennes, FR;
Abstract
A microstrip-type microwave sensor for the measurement of the dielectric properties of a solid or liquid material, constituted by a main line and two connected transmission lines integral at one of their extremities to the main line, the main line and two connected transmission lines being spaced from one another by a slot and being made integral with a substrate. The main line is connected to an electrical circuit by each of its two extremities to inject a sinusoidal signal, and wherein said main line has a width giving it an impedance in the range 50 Ohm, the two connected transmission lines being of the same width and of a length equal to one quarter of the wavelength guided in the substrate, the substrate having a height or thickness giving it flexibility or rigidity, the substrate being applied to a metallic support formed of a layer of metallic material.