The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2024
Filed:
Mar. 18, 2020
Applicant:
Daicel Corporation, Osaka, JP;
Inventor:
Yuichi Sakanishi, Tokyo, JP;
Assignee:
DAICEL CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); H01L 21/304 (2013.01);
Abstract
Provided is a polishing composition for semiconductor wiring providing an excellent polishing rate and preventing occurrence of dishing. The polishing composition for semiconductor wiring according to the present invention contains a compound represented by Formula (1) below:RO—(CHO)—H (1) where Rrepresents a hydrogen atom, a hydrocarbon group that has from 1 to 24 carbon atoms and may include a hydroxyl group, or a group represented by RCO, where the Rrepresents a hydrocarbon group having from 1 to 24 carbon atoms; and n represents an average degree of polymerization of glycerol units shown in the parentheses and is from 2 to 60.