The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Mar. 24, 2021
Applicant:

Science Applications International Corporation, Reston, VA (US);

Inventors:

John Timler, River Ridge, LA (US);

Xingcun C. Tong, Reston, VA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09D 11/52 (2014.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01); C09D 11/033 (2014.01); C09D 11/102 (2014.01); C09D 11/38 (2014.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
C09D 11/52 (2013.01); C09D 11/033 (2013.01); C09D 11/102 (2013.01); C09D 11/38 (2013.01); H05K 1/097 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01);
Abstract

Self-sintering conductive inks can be printed and self-sintered with a simple and low-cost process mechanized by exothermic alkali metal and water reaction, with enhanced electrical and thermal performance by liquid metal fusion. Such self-sintering conductive inks may include a gallium-alkali metal component and a water absorbing gel component. After patterning, the self-sintering inks, on reaching a designed trigger temperature (including room temperature), may metallize through a two-step process. Initially the gallium-alkali metal component activates and reacts with water released from the water absorbing gel component. Then the exothermic reaction between the water and the alkali element creates an intense and highly localized heating effect, which liquefies all metallic components in the ink and, on cooling, creates a solid metal trace or interconnect. Post cooling, the metal trace or interconnect cannot be reflowed without a significant temperature increase or other energetic input.


Find Patent Forward Citations

Loading…