The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Aug. 06, 2020
Applicant:

Fuji Polymer Industries Co., Ltd., Nagoya, JP;

Inventors:

Takumi Kataishi, Aichi, JP;

Yuko Kimura, Aichi, JP;

Mai Sugie, Aichi, JP;

Makoto Iwai, Aichi, JP;

Setsuo Kikuchi, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); C08K 3/013 (2018.01); C08L 83/06 (2006.01); H01L 23/373 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); C08K 3/013 (2018.01); C08L 83/06 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2296 (2013.01); C08K 2003/282 (2013.01); C08L 2203/20 (2013.01); C08L 2314/08 (2013.01); H01L 23/3737 (2013.01);
Abstract

A thermally conductive silicone gel composition of the present invention includes the following A to F: (A) an organopolysiloxane having two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having two Si—H groups per molecule; (C) an organohydrogenpolysiloxane having three or more Si—H groups per molecule; (D) at least one compound selected from the group consisting of D1 and D2: (D1) an organopolysiloxane having one alkenyl group per molecule and (D2) an organohydrogenpolysiloxane having one Si—H group per molecule; (E) a platinum catalyst; and (F) a thermally conductive filler in an amount of 100 to 600 vol % with respect to 100 vol % of the total amount of the A to E. The components A to F are cured. With this configuration, the thermally conductive silicone gel composition can reduce oil bleeding, even though the composition is a gel cured product.


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