The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Jun. 22, 2022
Applicants:

The Trustees of Princeton University, Princeton, NJ (US);

Heavy Metal Llc, Fremont, CA (US);

Inventors:

Adam Bayne Hopkins, San Jose, CA (US);

Salvatore Torquato, Princeton, NJ (US);

Assignees:

The Trustees of Princeton University, Princeton, NJ (US);

Heavy Metal LLC, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/111 (2006.01); B22F 1/052 (2022.01); B22F 1/065 (2022.01); B22F 3/11 (2006.01); B22F 7/00 (2006.01); B22F 7/02 (2006.01); B23K 26/342 (2014.01); B23K 26/354 (2014.01); B28B 1/00 (2006.01); B29C 45/00 (2006.01); B29C 64/153 (2017.01); B29C 64/165 (2017.01); B29C 64/371 (2017.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 70/10 (2020.01); C03C 3/04 (2006.01); C03C 12/00 (2006.01); C04B 20/00 (2006.01); C04B 28/02 (2006.01); C04B 35/547 (2006.01); C04B 35/56 (2006.01); C04B 35/626 (2006.01); C22C 14/00 (2006.01); C22C 32/00 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/44 (2006.01); C22C 38/56 (2006.01); B22F 10/28 (2021.01); B22F 10/34 (2021.01); B29C 64/268 (2017.01); B29K 105/00 (2006.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01); C22C 1/04 (2023.01); C22C 1/08 (2006.01); C22C 29/08 (2006.01);
U.S. Cl.
CPC ...
C04B 35/111 (2013.01); B22F 1/052 (2022.01); B22F 1/065 (2022.01); B22F 3/11 (2013.01); B22F 7/002 (2013.01); B22F 7/008 (2013.01); B22F 7/02 (2013.01); B23K 26/342 (2015.10); B23K 26/354 (2015.10); B28B 1/001 (2013.01); B29C 45/0001 (2013.01); B29C 64/153 (2017.08); B29C 64/165 (2017.08); B29C 64/371 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 70/10 (2020.01); C03C 3/04 (2013.01); C03C 12/00 (2013.01); C04B 20/0096 (2013.01); C04B 28/02 (2013.01); C04B 35/547 (2013.01); C04B 35/56 (2013.01); C04B 35/5626 (2013.01); C04B 35/62695 (2013.01); C22C 14/00 (2013.01); C22C 32/0052 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C22C 38/44 (2013.01); C22C 38/56 (2013.01); B22F 10/28 (2021.01); B22F 10/34 (2021.01); B22F 2301/15 (2013.01); B22F 2301/205 (2013.01); B22F 2301/35 (2013.01); B22F 2302/10 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B29C 64/268 (2017.08); B29K 2105/0064 (2013.01); B29K 2105/251 (2013.01); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); C04B 2235/3217 (2013.01); C04B 2235/3847 (2013.01); C04B 2235/405 (2013.01); C04B 2235/446 (2013.01); C04B 2235/528 (2013.01); C04B 2235/5427 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/5472 (2013.01); C04B 2235/608 (2013.01); C22C 1/0458 (2013.01); C22C 1/08 (2013.01); C22C 29/08 (2013.01); Y02P 10/25 (2015.11);
Abstract

The present invention relates to granular composite density enhancement, and related methods and compositions. The applications where these properties are valuable include but are not limited to: 1) additive manufacturing ('3D printing') involving metallic, ceramic, cermet, polymer, plastic, or other dry or solvent-suspended powders or gels, 2) concrete materials, 3) solid propellant materials, 4) cermet materials, 5) granular armors, 6) glass-metal and glass-plastic mixtures, and 7) ceramics comprising (or manufactured using) granular composites.


Find Patent Forward Citations

Hopkins, Adam. (2024). Density enhancement methods and compositions (U.S. Patent No. 12151978). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12151978

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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