The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Sep. 30, 2022
Applicant:

Keishi Miwa, Kanagawa, JP;

Inventor:

Keishi Miwa, Kanagawa, JP;

Assignee:

RICOH COMPANY, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/145 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1433 (2013.01); B41J 2/14233 (2013.01); B41J 2/145 (2013.01); B41J 2002/14306 (2013.01); B41J 2002/14491 (2013.01);
Abstract

A head module includes: a head including: a nozzle plate having a nozzle from which a liquid is to be discharged; a channel substrate including an individual channel communicating with the nozzle, the nozzle plate bonded to a first bonding surface of the channel substrate; and a cover covering at least one side of a discharge surface of the nozzle plate of the head. The channel substrate has a size larger than the nozzle plate, the cover has a second bonding surface bonded to the first bonding surface of the channel substrate at an outer region of the nozzle plate with an adhesive, the discharge surface of the nozzle plate is liquid-repellent, and the first bonding surfaces of the channel substrate and the second bonding surface of the cover are lyophilic.


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