The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2024
Filed:
Jul. 26, 2022
Applicant:
Akio Yoshita, Kanagawa, JP;
Inventor:
Akio Yoshita, Kanagawa, JP;
Assignee:
RICOH COMPANY, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14233 (2013.01); B41J 2/1623 (2013.01); B41J 2002/14491 (2013.01);
Abstract
A bonded substrate includes: a first substrate; and a second substrate having a bonding surface bonded to the first substrate, wherein the second substrate includes a recess having a bottom surface recessed from a surface opposite to the bonding surface, and a difference between the maximum height and the minimum height of the bottom surface from the surface opposite to the bonding surface of the recess is less than 10 μm.