The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2024
Filed:
Dec. 27, 2018
Applicant:
Arkema Inc., King of Prussia, PA (US);
Inventors:
Azaz Vahora, Eagleville, PA (US);
James Joseph Henry, Downingtown, PA (US);
David Shin-Ren Liu, Bala Cynwyd, PA (US);
Assignee:
Arkema Inc., King of Prussia, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 70/00 (2020.01); B29C 64/118 (2017.01); B29C 64/314 (2017.01); B33Y 10/00 (2015.01); B33Y 40/10 (2020.01); B33Y 70/10 (2020.01); D01D 5/247 (2006.01); D01D 5/34 (2006.01); D01F 1/08 (2006.01); B29C 64/321 (2017.01); B29K 101/12 (2006.01);
U.S. Cl.
CPC ...
B29C 64/314 (2017.08); B29C 64/118 (2017.08); B33Y 10/00 (2014.12); B33Y 40/10 (2020.01); B33Y 70/00 (2014.12); B33Y 70/10 (2020.01); D01D 5/247 (2013.01); D01D 5/34 (2013.01); D01F 1/08 (2013.01); B29C 64/321 (2017.08); B29K 2101/12 (2013.01);
Abstract
The invention relates to thermoplastic filament for use in 3-D printers, in which the core of the filament is non-solid or mono-filament. The filament may contain a multitude of small micro-voids, (a micro foam), be a foam-core structure, be hollow, or have a monofilament core. The filament of the invention is especially useful with crystalline and semi-crystalline polymers, and reduces the negative effect of filament voids, formed by shrinkage during the cooling of the filament.