The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2024
Filed:
Jun. 25, 2019
Applicant:
Adata Technology Co., Ltd., New Taipei, TW;
Inventors:
Luca Di Fiore, New Taipei, TW;
Shih-Huang Tsai, New Taipei, TW;
Chih-Chun Huang, Taipei, TW;
Hsin-Cheng Hsu, New Taipei, TW;
Assignee:
ADATA TECHNOLOGY CO., LTD., New Taipei, TW;
Primary Examiner:
Int. Cl.
CPC ...
B29C 61/06 (2006.01); B29C 61/00 (2006.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01); C09D 5/02 (2006.01); C09D 177/02 (2006.01); G06F 3/0354 (2013.01); H05K 5/00 (2006.01); B29K 77/00 (2006.01); B29K 105/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 61/06 (2013.01); B29C 61/003 (2013.01); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); C09D 5/02 (2013.01); C09D 177/02 (2013.01); G06F 3/03543 (2013.01); H05K 5/00 (2013.01); B29K 2077/00 (2013.01); B29K 2105/0061 (2013.01); B29L 2031/3481 (2013.01);
Abstract
A housing structure manufacturing method and an electronic device are provided. The housing structure manufacturing method includes providing a plurality of memory polymeric materials, heating the plurality of memory polymeric materials, and forming the housing structure having a first morphology by printing the plurality of memory polymeric materials that are heated.