The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Aug. 07, 2020
Applicant:

Preh Gmbh, Bad Neustadt A.D. Saale, DE;

Inventors:

Peter Lochner, Wollbach, DE;

Steffen Neubauer, Hohenroth, DE;

Benedikt Rueckert, Bad Koenigshofen, DE;

Martin Suennemann, Hoechheim, DE;

Assignee:

PREH GmbH, Bad Neustadt A.D. Saale, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B29C 51/14 (2006.01); B32B 7/023 (2019.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B29L 9/00 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14811 (2013.01); B29C 45/1418 (2013.01); B29C 51/14 (2013.01); B32B 7/023 (2019.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B29C 2045/14237 (2013.01); B29K 2995/0026 (2013.01); B29L 2009/005 (2013.01); B29L 2031/3005 (2013.01); B32B 2250/02 (2013.01); B32B 2307/412 (2013.01); B32B 2307/414 (2013.01);
Abstract

A method for producing a plastic composite panel which is provided as a layer structure. The method includes providing a film layer structure comprising an adhesive layer which is arranged between two transparent plastic films. The film layer structure is pre-molded to assume an approximately final shape and is arranged in a molding tool so that a first main surface of the film layer structure is towards the molding surface of the molding tool and so that a cavity is formed between the second main surface of the film layer structure and a surface of the molding tool. The film layer structure is then back-molded in a thermal molding method step while introducing a thermoplastic material into the cavity to provide the layer structure. A pre-molding and back-molding step, a rigidification of the thermoplastic layer, and a demolding of the layer structure is further performed.


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