The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Aug. 06, 2021
Applicant:

Nps Co., Ltd., Cheongju-si, KR;

Inventor:

Seong Ho Bae, Daejeon, KR;

Assignee:

NPS CO., LTD., Cheongju-si, KR;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/364 (2014.01); B23K 26/02 (2014.01); B23K 26/38 (2014.01); B23K 37/04 (2006.01); B23K 103/00 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
B23K 26/364 (2015.10); B23K 26/02 (2013.01); B23K 26/38 (2013.01); B23K 37/0408 (2013.01); B23K 2103/172 (2018.08); B23K 2103/38 (2018.08);
Abstract

Disclosed is a film cutting apparatus for cutting a film fabric having a multilayer structure with a plurality of film layers and including a release film layer positioned at an outermost layer of one side of the film layers, the film cutting apparatus including a laser unit including a laser head configured to form a first cutting line on a predetermined first film group by cutting the first film group by selectively irradiating the first film group with a laser beam to include some film layers except for the release film layer among the film layers, and a cutting unit including a cutter configured to form a single cutting line by connecting a second cutting line and the first cutting line on a predetermined second film group by cutting the second film group using a cutting blade to include some film layers including at least the release film layer among the film layers.


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