The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Jul. 29, 2020
Applicant:

Boston Scientific Scimed, Inc., Maple Grove, MN (US);

Inventors:

Joseph Mayo, Medford, MA (US);

Matthew P. Jones, Shoreview, MN (US);

Raymond Gessler, Roberts, WI (US);

Asha D'Cunha, Hugo, MN (US);

Serena Scott, Worcester, MA (US);

Katrina Hansen, Shrewsbury, MA (US);

Jeffery T. Lersch, Monticello, MN (US);

Assignee:

Boston Scentific Scimed, Inc., Maple Grove, MN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 18/08 (2006.01); A61B 18/00 (2006.01); A61B 18/10 (2006.01); C23C 14/14 (2006.01); C23C 14/34 (2006.01); C23C 28/02 (2006.01);
U.S. Cl.
CPC ...
A61B 18/082 (2013.01); A61B 18/10 (2013.01); C23C 14/14 (2013.01); C23C 14/34 (2013.01); C23C 28/023 (2013.01); A61B 2018/00077 (2013.01); A61B 2018/00148 (2013.01); A61B 2018/00601 (2013.01);
Abstract

The present disclosure relates generally to the field of medical devices. In particular, the present disclosure relates to an electrosurgical surgical tip that includes a conductive and low-profile cutting surface to provide high current density radiofrequency energy with minimal thermal damage to surrounding tissues. For example, an electrosurgical tip of the present disclosure may include a ring of conductive material sputter-coated around a distal opening of a non-conductive base component and a strip of conductive material sputter-coated along a longitudinal axis of the non-conductive base component.


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