The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2024

Filed:

Jul. 21, 2020
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Xu Zhu, Shanghai, CN;

Wei Li, Dongguan, CN;

Chunjun Ma, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/04 (2006.01); F28F 21/08 (2006.01); H05K 5/00 (2006.01); H05K 7/20 (2006.01); H10K 50/87 (2023.01); H10K 77/10 (2023.01); H10K 102/00 (2023.01); C09K 5/14 (2006.01);
U.S. Cl.
CPC ...
H05K 5/04 (2013.01); F28F 21/089 (2013.01); H05K 5/0017 (2013.01); H05K 7/20963 (2013.01); C09K 5/14 (2013.01); H10K 50/87 (2023.02); H10K 77/111 (2023.02); H10K 2102/311 (2023.02);
Abstract

A composite structure includes a first layer and a second layer that are stacked, the first layer is configured to connect the second layer and a flexible display, and the second layer is configured to dissipate heat. Each of the first layer and the second layer includes a first surface and a second surface opposite to each other, where the first surface of the first layer is proximate to the flexible display, and the first surface of the second layer is proximate to the second surface of the first layer. An elastic modulus of the first layer is greater than or equal to an elastic modulus of the second layer, and a coefficient of thermal conductivity of the first layer is less than or equal to a coefficient of thermal conductivity of the second layer.


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