The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2024
Filed:
Jun. 10, 2021
Applicant:
Dic Corporation, Tokyo, JP;
Inventors:
Shunji Baba, Tokyo, JP;
Hidefumi Nishi, Tokyo, JP;
Assignee:
DIC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); H05K 2201/05 (2013.01); H05K 2201/10037 (2013.01); H05K 2201/10151 (2013.01);
Abstract
A sensor device in which flexibility is ensured over the entirety of the device and that can be manufactured at low costs is provided. The sensor device having flexibility includes a flexible substrate, a temperature/humidity sensor connected to the flexible substrate, and an exterior body formed of a soft material. The temperature/humidity sensor has a waterproof moisture-permeable material that covers a detection surface. The exterior body has an opening that exposes the waterproof moisture-permeable material. The flexible substrate is bonded at at least a peripheral part thereof to the exterior body.