The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2024
Filed:
Dec. 10, 2019
Tatsuta Electric Wire & Cable Co., Ltd., Higashiosaka, JP;
Sirou Yamauchi, Kizugawa, JP;
Hiroshi Tajima, Kizugawa, JP;
Yuusuke Haruna, Kizugawa, JP;
Takahiko Katsuki, Kizugawa, JP;
TATSUTA ELECTRIC WIRE & CABLE CO., LTD., Higashiosaka, JP;
Abstract
A shielded printed wiring board with electromagnetic wave shielding film on both sides thereof is produced by placing electromagnetic wave shielding films on the two sides of the printed wiring board, with ends thereof protruding past an end of the printed wiring board. The protruding ends of the electromagnetic wave shielding films are brought together, with an air gap therebetween, and an initial application of heat and pressure causes the ends of the electromagnetic wave shielding film to adhere to each other, but without completely curing adhesive resin components of the electromagnetic wave shielding films. Protective film layers are removed from the electromagnetic wave shielding films, followed by subsequent application of heat and pressure to complete cure of the adhesive resin and to remove the air gap.