The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2024

Filed:

Aug. 10, 2022
Applicant:

Meta Platforms Technologies, Llc, Menlo Park, CA (US);

Inventor:

Samuel Tam, Dale City, CA (US);

Assignee:

Meta Platforms Technologies, LLC, Menlo Park, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 23/50 (2023.01); H01R 12/59 (2011.01);
U.S. Cl.
CPC ...
H04N 23/50 (2023.01); H01R 12/592 (2013.01);
Abstract

A camera module includes an image sensor die, high-density interconnect (HDI) tape, and a number of passive electronic components. The image sensor die has a first side and a second side. The first side includes a pixel array, and the second side is opposite the first side. The HDI tape is a flexible substrate coupled to the image sensor. The HDI tape is at least partially folded or bent around the image sensor to couple to the HDI tape to the first and second sides of the image sensor die. The passive electronic components are coupled to the second side of the HDI tape and provide rigidity to the camera module.


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