The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2024

Filed:

Aug. 31, 2022
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yasuyuki Hara, Tokyo, JP;

Tomoyuki Goi, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); H01Q 1/22 (2006.01); H01Q 5/314 (2015.01);
U.S. Cl.
CPC ...
H01Q 9/0407 (2013.01); H01Q 1/2283 (2013.01); H01Q 5/314 (2015.01);
Abstract

Disclosed herein is an antenna module that includes solder balls provided on a surface of the element body having an antenna element. The solder balls include a signal ball disposed at an intersection between the second row virtual line and the second column virtual line and first to fourth ground balls disposed, out of a plurality of intersections between the first to third row virtual lines and the first to third column virtual lines, at any of intersections other than those at which the signal ball is disposed. No solder ball is disposed, out of the intersections between the plurality of row and column virtual lines, at least at some of the plurality of intersections other than those at which the first signal ball or first to fourth ground balls are disposed.


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