The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2024
Filed:
Dec. 30, 2021
Applicant:
Atieva, Inc., Newark, CA (US);
Inventors:
Ben Carlson-Sypek, Chandler, AZ (US);
DodgieReigh M. Calpito, Fairfield, CA (US);
Ryan Simpson, Maricopa, AZ (US);
Assignee:
Atieva, Inc., Newark, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 24/78 (2013.01); H01L 22/14 (2013.01); H01L 24/85 (2013.01); H01L 2224/7855 (2013.01); H01L 2224/78611 (2013.01); H01L 2224/789 (2013.01); H01L 2224/851 (2013.01); H01L 2224/859 (2013.01);
Abstract
In a general aspect, a wire bonding apparatus can include a supply of bond wire, a wire bonding head, and an electrical continuity tester. The wire bonding head can including a wire cutter. The wire cutter can be electrically conductive. The electrical continuity tester can be coupled between the supply of bond wire and the wire cutter.
Carlson-Sypek, Ben. (2024). In-process wire bond testing using wire bonding apparatus (U.S. Patent No. 12148730). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12148730
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile