The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2024
Filed:
Nov. 20, 2018
Mitsubishi Electric Corporation, Tokyo, JP;
Kazuya Ogawa, Tokyo, JP;
Tsuyoshi Osaga, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
An object is to provide a semiconductor device in which the area of inspection wiring for detecting chipping, cracks, or the like is narrowed. The semiconductor device includes a semiconductor substrate including an effective region including a semiconductor element and an ineffective region provided on a circumference of the effective region on a front surface thereof, and a rear surface electrode on a rear surface thereof; and inspection wiring provided in the ineffective region on the front surface of the semiconductor substrate so as to surround an outer periphery of the effective region. The inspection wiring is electrically connected to the rear surface electrode in such a manner that one end of the inspection wiring is in contact with the semiconductor layer which is provided in the ineffective region on the front surface of the semiconductor substrate and electrically connected to the rear surface electrode.