The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2024
Filed:
Nov. 20, 2021
Jcet Group Co., Ltd., Wuxi, CN;
Yaojian Lin, Wuxi, CN;
Jian Zuo, Wuxi, CN;
Danfeng Yang, Wuxi, CN;
Yinghua Gao, Wuxi, CN;
Shuo Liu, Wuxi, CN;
JCET GROUP CO., LTD., Wuxi, CN;
Abstract
The present invention provides a fan-out package structure and a method for manufacturing the same. The fan-out package structure includes at least one chip and at least one redistribution layer on a functional surface side of the chip, and the redistribution layer includes a dielectric layer and a metal wiring layer distributed within the dielectric layer. The fan-out package structure further includes at least one dummy wafer on the redistribution layer, and the dummy wafer is insulated from the chip and in contact with the metal wiring layer. By providing the dummy wafer on the redistribution layer and configuring the dummy wafer to connect to the metal wiring layer, the dummy wafer can not only function to support the structure and suppress the warpage, but also form a continuous heat dissipation channel, thereby improving thermal management capability of the fan-out package structure.