The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2024

Filed:

May. 18, 2021
Applicant:

Shenzhen Sunlord Electronics Co., Ltd., Guangdong, CN;

Inventors:

Xinshu Yu, Guangdong, CN;

Youyun Li, Guangdong, CN;

Shengcheng Xia, Guangdong, CN;

Zehong Yao, Guangdong, CN;

Yupeng Hong, Guangdong, CN;

Yingying Wang, Guangdong, CN;

Qiang Su, Guangdong, CN;

Wanhe Yi, Guangdong, CN;

Xin Che, Guangdong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 7/06 (2006.01); H01F 1/24 (2006.01); H01F 17/04 (2006.01); H01F 27/255 (2006.01); H01F 27/29 (2006.01); H01F 41/02 (2006.01);
U.S. Cl.
CPC ...
H01F 41/0246 (2013.01); H01F 1/24 (2013.01); H01F 17/045 (2013.01); H01F 27/255 (2013.01); H01F 27/292 (2013.01); H01F 2017/048 (2013.01);
Abstract

A manufacturing method of an integrally formed inductor, comprises: sintering a soft magnetic material to prepare a magnetic core plate with a plurality of grooves; respectively putting hollow coils into the plurality of grooves; putting a magnetic core plate provided with coils into a forming die, adding a soft magnetic material in a fluid state, and integrally forming the soft magnetic material in the fluid state on the magnetic core plate through pressing; coating semi-finished inductors with an insulating material to form an insulating coating layer, and exposing only two terminals of the coils; areas where the coil terminals are exposed on a surface of the insulating coating layer being metallized to form electrodes of the integrally formed inductor. Therefore, the disclosure provides a manufacturing method of an integrally formed inductor which is subminiature in size, ultra-thin and high in reliability.


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