The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2024

Filed:

Aug. 29, 2023
Applicant:

Bank of America Corporation, Charlotte, NC (US);

Inventors:

Yingcai Peng, Charlotte, NC (US);

Maneesh Kumar Sethia, Hyderabad, IN;

Abhijit Behera, Hyderabad, IN;

Sivashalini S, Chennai, IN;

Sandeep Reddy Kothapeta, Hyderabad, IN;

Assignee:

Bank of America Corporation, Charlotte, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G07F 19/00 (2006.01); G06F 21/86 (2013.01);
U.S. Cl.
CPC ...
G07F 19/207 (2013.01); G06F 21/86 (2013.01); G07F 19/209 (2013.01); G07F 19/211 (2013.01);
Abstract

A smart-dust information security and energy optimization process/machine/system is disclosed for use with an ATM. Tiny microelectromechanical systems (MEMS) less than 1 mm in size are deployed and distributed in and around the ATM internal and external components. The MEMS include various sensors to detect component malfunctions and identify security threats (e.g., card skimmers), and also to place the ATM in a reduced energy state whenever possible. MEMS interoperable components and sensors may include, inter alia, batteries, wireless transmitters/receivers, processors, memory, analog-to-digital converters, LIDAR, photo detectors, vibration detectors, motion detectors, wireless signal detectors for detecting Bluetooth or RFID signals, temperature sensors, humidity sensor, a power consumption/induced electromagnetic energy sensors, piezoelectric sensors, sound sensors, etc. The components and sensors are interoperable with one another, and the MEMS are in wireless communication with one another and ultimately with the ATM. Additional features and functionality are disclosed.


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