The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2024

Filed:

Sep. 20, 2019
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Swezin Than Tun, Tacoma, WA (US);

Jonathan Hughes, Tacoma, WA (US);

Nobuyuki Arai, Tacoma, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/24 (2006.01); C08G 59/32 (2006.01); C08G 59/50 (2006.01); C08J 5/04 (2006.01); C08J 5/24 (2006.01); C08L 81/06 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/245 (2013.01); C08G 59/32 (2013.01); C08G 59/504 (2013.01); C08J 5/042 (2013.01); C08J 5/24 (2013.01); C08J 5/243 (2021.05); C08L 81/06 (2013.01); C08L 2201/08 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01);
Abstract

An epoxy resin composition is provided which includes a poly-naphthalene-based epoxy resin having two or more epoxy groups per molecule combined with a non-linear multi-phenyl epoxy resin and an additional epoxy resin having an epoxy functionality of 3 or more, as well as a prepreg, and a fiber-reinforced composite material prepared using the epoxy resin composition. More specifically, an epoxy resin composition is provided which contains a combination of particular types of epoxy resins and curatives that, when cured, provides high flexural modulus and that is suitable for preparing a fiber-reinforced composite material capable of withstanding extreme use environments such as low-temperature environments and high-temperature moisture-absorbing environments. In addition, epoxy resin systems are provided which are capable of achieving a high Tg along with good thermal stability for long periods of time at elevated temperatures (e.g., 180° C. or more) when cured at 210° C. for 2 hours.


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