The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2024

Filed:

Nov. 13, 2019
Applicant:

Nippon Steel Chemical & Material Co., Ltd., Tokyo, JP;

Inventors:

Katsumasa Yagi, Tokyo, JP;

Dota Saito, Tokyo, JP;

Mutsuhito Tanaka, Tokyo, JP;

Masanori Ae, Tokyo, JP;

Hiroyuki Deai, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C01B 33/12 (2006.01); C08K 3/36 (2006.01); C09K 3/10 (2006.01);
U.S. Cl.
CPC ...
C01B 33/12 (2013.01); C08K 3/36 (2013.01); C01P 2004/32 (2013.01); C01P 2004/61 (2013.01); C01P 2006/12 (2013.01); C09K 3/1006 (2013.01);
Abstract

The purpose of the present invention is to provide: silica particles of which the maximum particle diameter can be minimized and which can achieve proper fluidability that cannot be achieved by the conventional techniques; and silica spherical particles which, when used as a filler for a heat-dissipating sheet, can achieve excellent heat conductivity and flexibility. Silica spherical particles characterized in that, when particles each having a size of 5 μm or more and imaged by an optical measurement are observed, the particle diameter of each of the particles, which is determined from the image, satisfies the following requirements. Requirements: D99≤29 μm, and 10 μm≤Dmode<D99, and D99/Dmode≤1.5, and Dmode≤20 μm.


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