The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2024
Filed:
Dec. 27, 2022
Seiko Epson Corporation, Tokyo, JP;
Keitaro Hashizume, Shiojiri, JP;
SEIKO EPSON CORPORATION, , JP;
Abstract
A three-dimensional shaping device includes a stage, a heater, a head dispensing a shaping material toward the stage to form a shaping layer, a thermal sensor measuring a temperature of a measurement region of the shaping layer, an actuator moving the stage, the thermal sensor, and/or the head relative to each other, and a processor. The processor sets the measurement region being a point. The point has the lowest heat dissipation property within the shaping layer. The processor causes the head to dispense the shaping material to form another shaping layer when the processor determines that the measured temperature is equal to or lower than the predetermined value and repeats the measurement and the determination if the processor determines that the measured temperature is higher than the predetermined value until the processor determines that the measured temperature is equal to or lower than the predetermined value.