The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2024
Filed:
Nov. 16, 2023
Hoya Corporation, Tokyo, JP;
Masao Takano, Akishima, JP;
HOYA CORPORATION, Tokyo, JP;
Abstract
A method for manufacturing a substrate includes processing a side face of a laminate that includes substrates and a sheet-shaped spacer disposed between adjacent substrates. The processing of the side face includes bringing the laminate into a pressed state, first side face processing for processing a side face of the laminate in the pressed state, releasing the laminate from the pressed state after the first side face processing, intermediate processing for performing one of dividing the laminate released from the pressed state into two or more laminates, combining the laminate released from the pressed state with another laminate in a stacking direction, and leaving the laminate released from the pressed state as it is, bringing the laminate that has undergone the intermediate processing into a pressed state after the intermediate processing, and processing a side face of the laminate in the pressed state after the intermediate processing.