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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12144197 B1

PDFFull Text
Date of Patent:
Nov. 12, 2024

Filed:

Dec. 16, 2022

Thin film packaging structure including stacked sioxny layers

Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Chengdu, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Zhiliang Jiang, Beijing, CN;

Shilong Wang, Beijing, CN;

Ping Wen, Beijing, CN;

Assignees:

CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Sichuan, CN;

BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;

Attorney:

Calfee, Halter & Griswold LLP

Primary Examiner:

Ida M Soward

Int. Cl.
CPC ...
H10K 50/84 (2023.01); H10K 50/844 (2023.01); G02F 1/1333 (2006.01); G06F 1/16 (2006.01); G09F 9/30 (2006.01); H01L 23/00 (2006.01); H01L 33/12 (2010.01); H01L 33/44 (2010.01); H10K 50/80 (2023.01); H10K 77/10 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 50/844 (2023.02); G02F 1/133305 (2013.01); G06F 1/1641 (2013.01); G06F 1/1652 (2013.01); G09F 9/301 (2013.01); H01L 23/564 (2013.01); H01L 33/12 (2013.01); H01L 33/44 (2013.01); H10K 50/80 (2023.02); H10K 77/111 (2023.02); H10K 2102/00 (2023.02); H10K 2102/311 (2023.02);
Abstract

A thin film packaging structure includes a first inorganic packaging layer for covering a device to be packaged; an organic packaging layer formed at a side of the first inorganic packaging layer; a second inorganic packaging layer formed at a side of the organic packaging layer facing away from the first inorganic packaging layer; and at least one first inorganic layer formed at a side of the first inorganic packaging layer facing away from the device to be packaged. The at least one first inorganic layer has an elasticity modulus greater than that of the first inorganic packaging layer or the second inorganic packaging layer. The present disclosure also provides a display panel.

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