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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12144181 B1

PDFFull Text
Date of Patent:
Nov. 12, 2024

Filed:

Jul. 03, 2023

Semiconductor memory

Applicant:

Kioxia Corporation, Tokyo, JP;

Inventor:

Go Oike, Mie Mie, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:

Kim & Stewart LLP

Primary Examiner:

Eduardo A Rodela

Int. Cl.
CPC ...
H10B 43/20 (2023.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 27/06 (2006.01); H10B 41/20 (2023.01); H10B 41/23 (2023.01); H10B 41/27 (2023.01); H10B 41/30 (2023.01); H10B 41/70 (2023.01); H10B 43/10 (2023.01); H10B 43/27 (2023.01); H10B 43/35 (2023.01); H10B 43/40 (2023.01); H10B 43/50 (2023.01); H10B 53/20 (2023.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H10B 43/40 (2023.02); H01L 23/5226 (2013.01); H01L 23/528 (2013.01); H01L 27/0688 (2013.01); H10B 41/20 (2023.02); H10B 41/23 (2023.02); H10B 41/27 (2023.02); H10B 41/30 (2023.02); H10B 41/70 (2023.02); H10B 43/10 (2023.02); H10B 43/20 (2023.02); H10B 43/27 (2023.02); H10B 43/35 (2023.02); H10B 43/50 (2023.02); H10B 53/20 (2023.02); H01L 23/53228 (2013.01); H01L 23/53257 (2013.01); H01L 23/53271 (2013.01);
Abstract

A semiconductor memory includes first to fourth stacked bodies. The first stacked body includes a first conductor, and an alternating stack of first insulators and second conductors above the first conductor in a region. The second stacked body includes a third conductor, and an alternating stack of second insulators and fourth conductors above the third conductor in another region. The third stacked body includes a fifth conductor adjacent to the first conductor via a third insulator in a separation region. The fourth stacked body includes a seventh conductor adjacent to the third conductor via a fifth insulator in the separation region. The fifth conductor is electrically insulated from the seventh conductor.

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