The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Jun. 10, 2022
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Yoshihito Otsubo, Nagaokakyo, JP;

Takafumi Kusuyama, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0007 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 1/0298 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10977 (2013.01);
Abstract

A module includes a main substrate having a first surface, a sub-module mounted on the first surface, a first component mounted on the first surface separately from the sub-module, and a first sealing resin formed so as to cover the first surface, the sub-module, and the first component. The sub-module includes a second component, a second sealing resin disposed so as to cover the second component, and an internal shielding film formed so as to cover at least a part of a surface of second sealing resin remote from the first surface. A surface of the sub-module remote from the first surface includes a striped section where an area covered with the internal shielding film and an area where the second sealing resin is exposed are alternately arranged.


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