The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Apr. 20, 2022
Applicant:

Quanta Computer Inc., Taoyuan, TW;

Inventors:

Chao-Jung Chen, Taoyuan, TW;

Yu-Nien Huang, Taoyuan, TW;

Herman Tan, Taoyuan, TW;

Tien-Juei Chuang, Taoyuan, TW;

Assignee:

QUANTA COMPUTER INC., Taoyuan, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20354 (2013.01); H05K 7/20309 (2013.01); H05K 7/20318 (2013.01); H05K 7/20381 (2013.01);
Abstract

A fluid cooling system includes a boiling plate, a compressor, and a condenser. The boiling plate contacts a heat-generating electronic component. The boiling plate receives a liquid such that the liquid absorbs heat from the electronic component and evaporates into a vapor. The compressor is fluidly connected the boiling plate and receives the vapor of the boiling plate. The compressor increases the pressure of the vapor such that the temperature of the vapor increases, and such that a saturation temperature of the vapor increases. The condenser is fluidly connected to the compressor and the boiling plate. The condenser receives the vapor from the compressor and removes heat from the vapor such that the vapor condenses back into the liquid. The boiling plate receives the liquid from the condenser. The system can include a pump that circulates the liquid and the vapor between the boiling plate, the compressor, and the condenser.


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