The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Nov. 15, 2022
Applicants:

Hyundai Motor Company, Seoul, KR;

Kia Corporation, Seoul, KR;

Inventors:

Sang Hun Lee, Taebaek-si, KR;

Hyong Joon Park, Hwaseong-si, KR;

Se Heun Kwon, Incheon, KR;

Assignees:

Hyundai Motor Company, Seoul, KR;

Kia Corporation, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20272 (2013.01); H01L 23/473 (2013.01); H05K 7/20254 (2013.01); H05K 7/20418 (2013.01); H05K 7/20927 (2013.01);
Abstract

An embodiment cooling apparatus for a power module includes a manifold cover provided with an inner space that defines a flow path for a cooling fluid and in which the power module can be embedded, a fin plate embedded in the manifold cover so as to contact the power module and including a plurality of cooling fins on a surface facing an inner surface of the manifold cover, and a guide wall extending from the inner surface of the manifold cover in a flow direction of the cooling fluid to define a plurality of first channels having first closed ends and second channels having second closed ends, the guide wall overlapping the cooling fins and having an end portion in contact with the cooling fins to allow the cooling fluid to flow to the first channels and the second channels between the cooling fins in the manifold cover.


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