The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Oct. 20, 2020
Applicant:
Nitto Denko Corporation, Osaka, JP;
Inventors:
Takahiro Takano, Osaka, JP;
Takahiro Minatoya, Osaka, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/38 (2006.01); H05K 5/02 (2006.01); H05K 1/05 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/386 (2013.01); H05K 1/0281 (2013.01); H05K 1/11 (2013.01); H05K 5/0247 (2013.01); H05K 1/056 (2013.01); H05K 1/111 (2013.01); H05K 3/007 (2013.01);
Abstract
A pressure-sensitive adhesive sheet-including wiring circuit board includes a wiring circuit board including a base insulating layer, a conductive layer disposed on a one-side surface in a thickness direction of the base insulating layer, and a cover insulating layer disposed on the one-side surface in the thickness direction of the base insulating layer so as to cover the conductive layer, and a pressure-sensitive adhesive sheet disposed on the surface of either one side or the other side in the thickness direction of the wiring circuit board.