The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Jan. 11, 2022
Applicant:
Lotte Energy Materials Corporation, Jeollabuk-do, KR;
Inventors:
Chang Yol Yang, Jeollabuk-do, KR;
Jung Woo Seo, Jeollabuk-do, KR;
Kideok Song, Jeollabuk-do, KR;
Sunhyoung Lee, Jeollabuk-do, KR;
Assignee:
Lotte Energy Materials Corporation, Jeollabuk-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); C25D 3/38 (2006.01); C25D 5/48 (2006.01); C25D 9/04 (2006.01); H05K 1/03 (2006.01); H05K 3/18 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/38 (2013.01); C25D 3/38 (2013.01); C25D 5/48 (2013.01); C25D 9/04 (2013.01); H05K 1/032 (2013.01); H05K 3/188 (2013.01); H05K 2201/0355 (2013.01);
Abstract
The present invention relates to a surface-treated copper foil, which has excellent adhesive strength with a resin substrate, shows low bending deformation after adhesion with a resin substrate, and is suitable as a high-frequency foil due to its low transmission loss, to a copper clad laminate comprising same, and to a printed wiring board.
Yang, Chang. (2024). Low-roughness surface-treated copper foil with low bending deformation, copper clad laminate comprising same, and printed wiring board (U.S. Patent No. 12144124). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12144124
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile