The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Feb. 23, 2021
Applicant:
Nippon Mektron, Ltd., Tokyo, JP;
Inventors:
Garo Miyamoto, Tokyo, JP;
Shunsuke Aoyama, Tokyo, JP;
Assignee:
NIPPON MEKTRON, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/34 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05B 3/34 (2013.01); H05K 1/0212 (2013.01); H05K 1/189 (2013.01); H05B 2203/013 (2013.01); H05B 2203/017 (2013.01); H05K 2201/0355 (2013.01);
Abstract
Provided is a heater which includes a flexible printed wiring board, in which the flexible printed wiring board includes a base film, a first metal foil, and a second metal foil, the first metal foil forms a heater circuit portion that generates heat when energized, on a first surface of the base film, and the second metal foil forms a heat conductive foil portion that maintains a non-energized state, on a second surface of the base film.