The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Mar. 13, 2020
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Masashi Omura, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/64 (2006.01); H03H 9/02 (2006.01); H03H 9/145 (2006.01); H03H 9/25 (2006.01);
U.S. Cl.
CPC ...
H03H 9/6489 (2013.01); H03H 9/02559 (2013.01); H03H 9/02866 (2013.01); H03H 9/02992 (2013.01); H03H 9/145 (2013.01); H03H 9/25 (2013.01); H03H 9/6483 (2013.01);
Abstract

An acoustic wave filter device includes a substrate, first and second acoustic impedance layers, a piezoelectric layer, first and second interdigital transducer electrodes, an input terminal, an output terminal, ground terminals, a series arm circuit, and a parallel arm circuits. The first interdigital transducer electrode at least partially overlaps the first acoustic impedance layer in the plan view. The second interdigital transducer electrode at least partially overlaps the second acoustic impedance layer in the plan view. The series arm circuit is provided on a first path connecting the input terminal and the output terminal and includes the first and second interdigital transducer electrodes. A conductive layer in the first acoustic impedance layer and a conductive layer in the second acoustic impedance layer are electrically insulated from each other.


Find Patent Forward Citations

Loading…