The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Jul. 29, 2022
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Margaret Spillane, Limerick, IE;

Kevin Kelliher, Coolflugh, IE;

Owen Cregg, Clarinbridge, IE;

Paul J. Harriman, Belfair, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 3/158 (2006.01); H02M 1/32 (2007.01);
U.S. Cl.
CPC ...
H02M 3/1584 (2013.01); H02M 1/327 (2021.05);
Abstract

A multiphase power stage that includes addressing and communication techniques to read temperatures of the phases for thermal load balancing is disclosed. The disclosure describes driver modules that can be assigned addresses for serial communication on a common communication bus by temporarily communicating the addresses over dedicated pulse width modulation connections between the driver modules and the controller. After assignment, a temperature request message, addressed to a driver module, can trigger the driver module to transmit an analog temperature signal to a common temperature bus coupled between the driver modules and the controller. The temperatures of the driver modules may be collected in order to activate and deactivate driver modules based on their temperatures, which can balance a thermal load on the multiphase power stage.


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