The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Mar. 17, 2020
Applicant:

Teknologian Tutkimuskeskus Vtt Oy, Espoo, FI;

Inventors:

Mikko Varonen, Espoo, FI;

Antti Lamminen, Espoo, FI;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 5/16 (2006.01); H01L 23/66 (2006.01); H01Q 21/00 (2006.01);
U.S. Cl.
CPC ...
H01P 5/16 (2013.01); H01L 23/66 (2013.01); H01Q 21/0075 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6683 (2013.01);
Abstract

A hybrid millimeter-wave Wilkinson divider comprises an input port (), a first output port (), a second output port (), and transmission lines connecting the input port () to the first and second output ports () implemented by transmission lines in a carrier substrate (PCB,). An isolation resistor of the Wilkinson divider connected between the first and second output ports () is integrated in a monolithic micro-wave integrated circuit (MMIC) chip () installed on the carrier substrate. On the MMIC chip the isolation resistor is connected between RF input metal pads. A compensation circuit for parasitic capacitances caused by the RF input metal pads is provided on the MMIC chip () so that the on-chip resistor appears as a pure resistance to the output ports () of the Wilkinson divider on the carrier substrate (PCB,).


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