The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Jul. 21, 2022
Applicant:

Nuvoton Technology Corporation Japan, Kyoto, JP;

Inventor:

Yusuke Kanda, Toyama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/778 (2006.01); H01L 29/20 (2006.01); H01L 29/40 (2006.01); H01L 29/423 (2006.01); H01L 29/47 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7786 (2013.01); H01L 29/2003 (2013.01); H01L 29/402 (2013.01); H01L 29/42316 (2013.01); H01L 29/475 (2013.01); H01L 29/7787 (2013.01);
Abstract

A semiconductor device includes: a first nitride semiconductor layer; a second nitride semiconductor layer; a source electrode and a drain electrode; and a gate electrode that is spaced apart from the source electrode and the drain electrode, and is in contact with the second nitride semiconductor layer. The gate electrode includes: a first barrier layer that includes TaN, has a layer thickness of Z1, and forms a Schottky junction with the second nitride semiconductor layer; a second barrier layer that is disposed above and in contact with the first barrier layer, includes TiN or WN, and has a layer thickness of Z2; and a wiring layer disposed above and in contact with the second barrier layer. In the semiconductor device, 200 nm≥Z1+Z2≥50 nm, Z1<Z2, and 50 nm>Z1>3 nm are satisfied.


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