The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Feb. 28, 2020
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Tomomi Ito, Kanagawa, JP;
Kazuyoshi Yamashita, Kanagawa, JP;
Atsushi Masagaki, Kanagawa, JP;
Shinobu Asayama, Kanagawa, JP;
Shinya Itoh, Kanagawa, JP;
Haruyuki Nakagawa, Kanagawa, JP;
Kyohei Mizuta, Kanagawa, JP;
Susumu Ooki, Kanagawa, JP;
Osamu Oka, Kanagawa, JP;
Kazuto Kamimura, Kumamoto, JP;
Takuji Matsumoto, Kumamoto, JP;
Kenju Nishikido, Kumamoto, JP;
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Abstract
There is provided an image sensor including a first substrate including a plurality of pixels and a plurality of vertical signal lines and a plurality of first wiring layers and a second substrate including a plurality of second wiring layers. The first and second substrates are secured together between the pluralities of first and second wiring layers. First pads are provided between one of the plurality of first wiring layers and one of the plurality of second wiring layers and second pads are provided between another of the plurality of first wiring layers and another of the plurality of second wiring layers. First vias and second vias connect the first pads and the one of the plurality of first wiring layers and the one of the plurality of second wiring layers together.